Corsair XTM50 High Performance Thermal Paste Kit, 5g

MX78363 XTM50 High Performance Thermal Paste Kit, 5g
MX78363 XTM50 High Performance Thermal Paste Kit, 5g MX78363 XTM50 High Performance Thermal Paste Kit, 5g MX78363 XTM50 High Performance Thermal Paste Kit, 5g MX78363 XTM50 High Performance Thermal Paste Kit, 5g

Product Info

CORSAIR XTM50 High Performance CPU / GPU Thermal Compound, 5g

Non-conductive and easy to apply, XTM50 ensures your PC stays cool under pressure
CORSAIR's new XTM50 High Performance Thermal Paste is the most complete solution to help lower your PC component temperatures!

XTM50's premium zinc oxide-based compound efficiently transfers heat from your PCs hottest components, lowering temperatures compared to common thermal paste.

Using XTM50 is easy, with an included stencil and applicator taking the guesswork out of application and ensuring you use the right amount, every time.

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Features

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  • Enthusiast CPU Thermal Compound:
    Premium Zinc Oxide based thermal compound for optimal thermal performance
  • Cools your CPU and GPU:
    Install new, or replace existing thermal compound on your CPU and GPU to improve heat transfer and lower temperatures
  • Improved CPU Cooling:
    Ultra-low thermal impedance lowers CPU temperatures vs common thermal paste
  • Installation Made Easy:
    An included application stencil and spreader take the guesswork out of applying XTM50 to your CPU cooler.
  • Filling the Gap:
    XTM50’s low-viscosity allows it to easily fill microscopic abrasions and channels for peak thermal transfer
  • Long Service Life:
    XTM50’s high-stability liquid compound lasts for years with no drying, cracking or change in consistency
  • Safe For You And Your PC:
    This Paste is Non-conductive and contains Zero Volatile compounds
  • Thermal Conductivity: 5.0W/mK
  • Thermal Impedance: 0.009° C -in2/Watt

Specifications

Make and Model Corsair XTM50 Thermal Paste, 5g
Part Number CT-9010002-WW
   
Material Low Viscosity Premium Zinc Oxide (ZnO) Thermal Compound with ultra-low thermal impedance
Application Increases thermal efficiency of heat transfer between CPUs and GPUs and their Heat Sinks better than standard Thermal Paste
   
Dimensions (LxWxH) N/A
Weight Thermal Paste: 5g