The Hyper 212 EVO cooling systems are designed and optimized to provide the best user experience and cooling potential for a new generation of processors. The Hyper 212 EVO now features four Cooler Master patented Continuous Direct Contact™ (CDC) heat pipes that are tightly packed into a flat array on the CPU Cooler base. This acts as a virtual vapor chamber that dissipates a large amount of heat. The aluminum fin structure has been optimized to provide the perfect performance balance between high and low speed fan operations.
- Well-balanced cooling performance provides fin optimizations with perfect balance between high and low speed operations.
- 4 Direct Contact heat pipes with the patented CDC™ (Continuous Direct Contact) technology - creating a perfect, sleek surface for heat conduction.
- Wide-range PWM fan with unique wave-shaped blade design for excellent airflow.
- Versatile all-in-one mounting solution supporting the latest Intel® LGA2066, LGA2011-v3, LGA2011, LGA1366, LGA1156, LGA1155, LGA1151, LGA1150 and AMD AM4, AM3+, AM3, AM2+, AM2, FM2+, FM2, FM1
Well balanced cooling
Fin optimizations provide perfect balance between high and low speed operations
4 direct contact heat pipes
Aluminum fins with 4 direct contact heat pipes to provide excellent heat dissapation.
Patented CDC™ (Continuous Direct Contact) technology, side-by-side heat pipe configurations with no gaps creating a perfectly smooth surface for heat conduction.
All in one mounting solution
Compatible with Intel® LGA2066, LGA2011-v3, LGA2011, LGA1366, LGA1156, LGA1155, LGA1151, LGA1150 & AMD Socket FM1 / FM2 / AM3+ / AM3 / AM2+ / AM2
Dual fan design
Supports an optional 2nd 120mm fan to increase cooling performance.
120mm PWM fam with quick snap fan bracket design
Includeds a new 120mm PWM fan with anti-vibration rubber pads and a quick snap cover for an easily expedited fan installation.
CDC™ vs Direct Contact
Continuous direct contact
Thanks to high precision machinery several heat pipes can be combined into a tightly packed virtual vapor chamber array with a perfectly flat and uniform surface. As a result the IHS and CPU below it get cooled more evenly, and more heat pipes can be packed in small space improving cooling performance.
Gaps between heat pipes result in uneven heat distribution which can create or worsen hot spots on the CPU. As a result of the gaps the amount of heat pipes touching the center of the IHS is lower and their surface area is lower, reducing the heat sink's efficiency.
|CPU Socket||Intel: Socket LGA 2011 / 1366 / 1155 / 1151 / 1150
AMD: AM4, AM3+, AM3, AM2+, AM2, FM2+, FM2, FM1
|Heat Sink Material||4 Direct Contact Heat Pipes / Aluminum Fins|
|Heat Sink Dimensions||116 x 51 x 159 mm
4.6 x 2.0 x 6.3 in
|Heat Sink Weight||465g
|Heat Pipe Thickness||6 mm|
|Speed||600 – 2,000 RPM (PWM) ± 10%|
|Airflow||24.9 – 82.9 CFM ± 10%|
|Air Pressure||0.3 – 2.7mm H2O ± 10%|
|Noise Level||9 - 36 dBA|
|Rated Voltage||12 VDC|
|Dimensions||120 x 120 x 25 mm
4.7 x 4.7 x 1 in
|Bearing Type||Long Life Sleeve Bearing|
|Dimensions||120 x 80 x 159mm|