MG Chemicals Silicone Heat Transfer Compound, 4g
Product Info
860 is a thermally conductive silicone paste. It is designed to reduce thermal resistance between irregular metal surfaces. It is most commonly used to improve heat flow between heat sinks and heat-generating components, such as CPUs, GPUs, LEDs, motors, and power components.
Features
- High thermal conductivity
- High dielectric strength
- Broad service temperature of -40 to 200 °C (-40 to 392 °F)
- Excellent corrosion resistance
- Non-bleeding
- Non-electrically conductive
- Long service life
- MG Chemicals MSDS sheet
Specifications
| Product Type | Thermal Compound |
|---|---|
| Thermal Conductivity | 0.66 W/(mK) |
| Viscosity | Thixotropic paste |
| Density | 2.40 g/ml |
| Volume Resistivity | 1.5x 1015 Ω-cm |
| Coverage | < 656 cm² / < 0.70 ft² |
| Size | 4 gram tube |
Package Contents
- Silicone Heat Transfer Compound, 4g
