MG Chemicals Silicone Heat Transfer Compound, 4g

MX24939 Silicone Heat Transfer Compound, 4g
MX24939 Silicone Heat Transfer Compound, 4g

Product Info

860 is a thermally conductive silicone paste. It is designed to reduce thermal resistance between irregular metal surfaces. It is most commonly used to improve heat flow between heat sinks and heat-generating components, such as CPUs, GPUs, LEDs, motors, and power components.

Features

  • High thermal conductivity
  • High dielectric strength
  • Broad service temperature of -40 to 200 °C (-40 to 392 °F)
  • Excellent corrosion resistance
  • Non-bleeding
  • Non-electrically conductive
  • Long service life
  • MG Chemicals MSDS sheet

Specifications

Product Type Thermal Compound
Thermal Conductivity 0.66 W/(mK)
Viscosity Thixotropic paste
Density 2.40 g/ml
Volume Resistivity 1.5x 1015 Ω-cm
Coverage < 656 cm² / < 0.70 ft²
Size 4 gram tube

Package Contents

  • Silicone Heat Transfer Compound, 4g