B660M AORUS PRO AX DDR4 – Performance Unleashed

Intel® B660 Motherboard with 6+2+1 Phases Hybrid Digital VRM with MOS Heatsink, 2 x PCIe 4.0 M.2 with Thermal Guard, 2.5GbE LAN, WI-FI 6 802.11ax, Rear USB 3.2 Gen 2 Type-C, RGB FUSION 2.0, Q-Flash Plus

Build a compact system with the B660M DS3H DDR4 LGA 1700 Micro-ATX Motherboard from GIGABYTE. Whether you are building a gaming system, or just looking to get some work done with a small form factor, the B660 DS3H gives you the utility typically found within larger motherboards.

• Supports 12th Gen Intel® Core™ Series Processors
• Dual Channel Non-ECC Unbuffered DDR4, 4 DIMMs
• 6+2+1 Phases Hybrid Digital VRM with MOS Heatsink
• WI-FI 6 802.11ax 2T2R & BT5 with AERO Antenna
• Fast 2.5 GbE LAN with Bandwidth Management
• Dual Ultra-Fast NVMe PCIe 4.0 x4 M.2 with Thermal Guard
• Rear SuperSpeed USB 3.2 Gen 2 TYPE-C for Fast and Versatile Connections
• High Quality Audio Capacitors and Audio Noise Guard
• RGB FUSION 2.0 supports Addressable LED & RGB LED Strips
• Smart Fan 6 Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP
• Q-Flash Plus Update BIOS without Installing the CPU, Memory and Graphics Card

* Actual support may vary by CPU.
* 6+6 phases parallel power design.

6+2+1 Phases Hybrid Power Design

Cleaner and more efficient power delivery to the CPU with better thermal performance ensure stability under high CPU frequencies and heavy loading.

• 6+2+1 Phases Low RDS(on) MOSFETs
• Solid capacitors to improve transient response and minimize oscillation
• 8-pin Solid Pin CPU Power Connector

PCIe 4.0 Design

GIGABYTE B660 Motherboards are ready to work with the PCIe 4.0 devices which are expected to experience twice bandwidth than the current PCIe 3.0 devices. To reach the high speed and maintain good signal integrity, GIGABYTE R&D uses the low impedance PCB to provide the maximum performance.

Support for DDR4 XMP up to 5333MHz and Beyond*

GIGABYTE is offering a tested and proven platform that ensures proper compatibility with profiles up to 5333MHz and beyond. All users need to do to attain this performance boost is to ensure that their memory module is XMP capable and that the XMP function is activated and enabled on their GIGABYTE motherboard.

* XMP Profile support may vary depending on memory module.

Hybrid Cores Optimization

With new Intel Hybrid technology, GIGABYTE exclusively creates two new "CPU Upgrade" in BIOS profiles to meet different users' scenarios by adjusting P-Core and E-Core activation and voltage policy.

M.2 Thermal Guard

With durability in mind, GIGABYTE provides a thermal solution for M.2 SSD devices. The M.2 Thermal Guard prevents throttling and bottlenecks from high speed M.2 SSDs as it helps to dissipate heat before it becomes an issue.

Fully Covered MOSFET Heatsink

2X Large Surface - Increased surface area up to 2X larger compared to traditional heatsinks. It improves heat dissipation from the MOSFETs.

Real One-piece Build - TMOS is a TRUE single piece heatsink. Its one-piece design and larger surface drastically improve the cooling performance against competitors’ multi-piece design.

Multi-cut Design - TMOS features several channels and inlets on the heatsink. This design allows for the air flow to go through which leads to a great improvement of the heat transfer performance.

M.2 Thermal Guard

With durability in mind, GIGABYTE provides a thermal solution for M.2 SSD devices. The M.2 Thermal Guard prevents throttling and bottlenecks from high speed M.2 SSDs as it helps to dissipate heat before it becomes an issue.

SmartFan 6

Smart Fan 6 contains several unique cooling features that ensure gaming PC maintain its performance while staying cool and quiet. Multiple fan headers can support PWM/DC fan and pump, and users can easily define each fan curve based on different temperature sensors across the board via intuitive user interface.

First Adopter on 2.5 GbE LAN Onboard

Adoption of 2.5G LAN provide up to 2.5GbE network connectivity, with at least 2 times faster transfer speeds compared to general 1GbE networking, perfectly designed for gamers with ultimate online gaming experience.

Wi-Fi 6 802.11ax + BT 5 Module

Wireless solution supports 802.11ax, enables gigabit wireless performance, provides smooth video streaming, better gaming experience, few dropped connections and speeds up to 2.4Gbps*. Moreover, Bluetooth 5 provides 4X range over BT 4.2 and with faster transmission.

USB 3.2 Gen 2x2 Type-C

The USB Type-C is a new reversible connector that is loaded with useful features such as USB 3.2 Gen2 support for 10Gb/s transfer speed. Powered by the Intel® USB 3.2 Gen2 controller, this little port provides the best USB Type-C experience possible.

HDMI 2.0 for 4K UHD Display and HDCP 2.2 Supported

HDMI 2.0, which is backwards compatible with HDMI 1.4, offers 18 Gb/s of bandwidth – nearly twice that of the previous generation. This unlocks the potential for users to transfer multiple video streams, as well as a native cinematic 21:9 ratio (which most movies are shot in), offering the best visual experience for viewers.

High-End Audio Capacitors

GIGABYTE motherboards use high-end audio capacitors. These high quality capacitors help deliver high resolution and high fidelity audio to provide the most realistic sound effects for gamers.

Audio Noise Guard

GIGABYTE motherboards feature an audio noise guard that essentially separates the board's sensitive analog audio components from potential noise pollution at the PCB level.

Q-Flash Plus

With GIGABYTE Q-Flash Plus, you don't need to install the CPU, memory and graphics card nor enter the BIOS menu to flash the BIOS. Just download and save a new BIOS file (rename to gigabyte.bin) on the USB flash drive, then press the dedicated Q-Flash Plus button and you're good to go!

Solid Pin Power Connectors

B660 motherboards feature solid plated ATX 12V 8pin power connectors to offer a stable power supply during CPU overloading.

RGB Fusion 2.0

B660 motherboards feature RGB FUSION 2.0 to offer lighting effected options and customized settings with outstanding aesthetics, and able to let enthusiasts building a stylish and unique gaming PC.

Refreshed BIOS

The BIOS is essential for users during initial setup to allow for the most optimal settings. With a new GUI and easier to use functionalities, GIGABYTE has been able to reinvent the BIOS to give users a better experience while setting up their new system.

EasyTune™

GIGABYTE's EasyTune™ is a simple and easy-to-use interface that allows users to fine-tune their system settings or adjust system and memory clocks and voltages in a Windows environment. With Smart Quick Boost, one click is all it takes to automatically overclock your system, giving an added performance boost when you need it the most.

System Information Viewer

GIGABYTE System Information Viewer is a central location that gives you access to your current system status. Monitor components such as the clocks and processor, set your preferred fan speed profile, create alerts when temperatures get too high or record your system's behavior; these are the possibilities of the System Information Viewer.

Ultra Durable

GIGABYTE Ultra Durable™ features its product durability and high-quality manufacturing process. GIGABYTE motherboards use the best components and reinforce every slots to make each of them solid and durable.

Additional Information:

Visit the Manufacturer Web Page for Full Details

• Windows® 10 64-bit

Make and Model	Gigabyte B660M DS3H AX DDR4 mATX Motherboard
CPU	LGA1700 socket: Support for 12th Generation Intel® Core™, Pentium® Gold and Celeron® Processors* L3 cache varies with CPU * Please refer to "CPU Support List" for more information.
Chipset	Intel® B660 Express Chipset
Memory	Support for DDR4 5333(O.C.)/ DDR4 5133(O.C.)/ DDR4 5000(O.C.)/ 4933(O.C.)/ 4800(O.C.)/ 4700(O.C.)/ 4600(O.C.)/ 4500(O.C.)/ 4400(O.C.)/ 4300(O.C.)/ 4266(O.C.) / 4133(O.C.) / 4000(O.C.) / 3866(O.C.) / 3800(O.C.) / 3733(O.C.) / 3666(O.C.) / 3600(O.C.) / 3466(O.C.) / 3400(O.C.) / 3333(O.C.) / 3300(O.C.) / 3200/ 3000/ 2933/ 2666/ 2400/ 2133 MHz memory modules 4 x DDR DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory Dual channel memory architecture Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode) Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules Support for Extreme Memory Profile (XMP) memory modules (Please refer "Memory Support List" for more information.)
Expansion Slots	1 x PCI Express x16 slot, running at x16 (The PCIEX16 slot conforms to PCI Express 4.0 standard.) 2 x PCI Express x1 slots (The PCIEX1 slots conform to PCI Express 3.0 standard.)
Multi-GPU Support	N/A
Onboard Graphics	Integrated Graphics Processor-Intel® HD Graphics support: 1 x HDMI port, supporting a maximum resolution of 4096x2160@60 Hz * Support for HDMI 2.1 version and HDCP 2.3. 1 x DisplayPort, supporting a maximum resolution of 4096x2304@60 Hz * Support for DisplayPort 1.2 version and HDCP 2.3. 1 x DisplayPort, supporting a maximum resolution of 4096x2304@60 Hz * Support for DisplayPort 1.2 version.
Storage	CPU: 1 x M.2 connector (Socket 3, M key, type 2260/2280 PCIe 4.0 x4/x2 SSD support) (M2A_CPU) Chipset: 1 x M.2 connector (Socket 3, M key, type 2260/2280 PCIe 4.0 x4/x2 SSD support) (M2P_SB) 4 x SATA 6Gb/s connectors Support for SATA RAID 0, RAID 1, RAID 5, and RAID 10. Intel® Optane™ Memory Ready * System acceleration with Intel® Optane™ Memory can only be enabled on the M.2 connector supported by the Chipset.
USB	Chipset: 1 x USB Type-C port on the back panel, with USB 3.2 Gen 2 support 5 x USB 3.2 Gen 1 ports (3 ports on the back panel, 2 ports available through the internal USB header) 2 x USB 2.0/1.1 ports on the back panel Chipset+2 USB 2.0 Hubs: 4 x USB 2.0/1.1 ports available through the internal USB headers
LAN	Realtek® 2.5GbE LAN chip (2.5 Gbps/1 Gbps/100 Mbps)
Wireless Communication	Intel® Wi-Fi 6 AX201 (For PCB rev. 1.0) WI-FI a, b, g, n, ac, ax, supporting 2.4/5 GHz Dual-Band BLUETOOTH 5.2 Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate Intel® Wi-Fi 6 AX200 (For PCB rev. 1.1) WI-FI a, b, g, n, ac, ax, supporting 2.4/5 GHz Dual-Band BLUETOOTH 5.2 Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate Intel® Wi-Fi 6E AX211 (For PCB rev. 1.2) WI-FI a, b, g, n, ac, ax, supporting 2.4/5/6 GHz carrier frequency bands BLUETOOTH 5.2 Support for 11ax 160MHz wireless standard and up to 2.4 Gbps data rate
Audio	Realtek®Audio CODEC High Definition Audio 2/4/5.1/7.1-channel
Back Panel I/O	2 x USB 2.0/1.1 ports 1 x PS/2 keyboard/mouse port 2 x SMA antenna connectors (2T2R) 1 x HDMI port 2 x DisplayPorts 3 x USB 3.2 Gen 1 ports 1 x USB Type-C port, with USB 3.2 Gen 2 support 1 x RJ-45 port 3 x audio jacks
Internal I/O Connectors	1 x 24-pin ATX main power connector 1 x 8-pin ATX 12V power connector 1 x CPU fan header 3 x system fan headers 1 x addressable LED strip header 1 x RGB LED strip header 2 x M.2 Socket 3 connectors 4 x SATA 6Gb/s connectors 1 x front panel header 1 x front panel audio header 1 x USB 3.2 Gen 1 header 2 x USB 2.0/1.1 headers 1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only) 1 x S/PDIF Out header 1 x Q-Flash Plus button 1 x reset button 1 x reset jumper 1 x Clear CMOS jumper
Operating System	Supports Windows® 11 64-bit Supports Windows® 10 64-bit
I/O Controller	iTE® I/O Controller Chip
BIOS	1 x 256 Mb flash Use of licensed AMI UEFI BIOS PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0
Form Factor	Micro ATX Form Factor
Dimensions (LxW)	24.4 x 24.4 cm
Weight	N/A